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TSK Schill GmbH Closes 2024 With a Record Turnover

01/14/2025 | TSK Schill GmbH
At TSK, the course continues to be set for growth. Despite the turbulent market development, we were able to increase our turnover “EBIT”. We generated a large proportion of our turnover with Solution Business.

SMTA UHDI Symposium: Shortening the Learning Curve

01/15/2025 | Marcy LaRont, I-Connect007
SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.

Data Paints a Picture—Can You See It?

01/09/2025 | Marcy LaRont, PCB007 Magazine
Andrew Kelley is CTO of Xact PCB, a company founded by engineers with firsthand experience in PCB fabricators. Xact PCB has developed a cutting-edge system to monitor and predict the registration of inner layers through advanced registration control systems. By leveraging data collected from various production stages, Xact PCB’s GX tool enhances precision. It minimizes errors, ensuring that the final products meet their customers' exact specifications while eliminating the need for costly pilot lots.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

Focus on electronica: Standards and the Factory of the Future

01/08/2025 | I-Connect007 Editorial Team
Dr. Thomas Marktscheffel, director of product management software solutions for ASMPT, gave a presentation at electronica 2024 titled Standards Driving the Factory of the Future. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
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