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IMAPS Enhances IMAPS Academy

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The International Microelectronics Assembly and Packaging Society (IMAPS), the leading organization dedicated to advancing microelectronics and electronics packaging, is pleased to announce the updated IMAPS Academy—an enhanced online training platform designed to address the industry's growing workforce development needs.

Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging

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As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association today announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.

Siemens Launches SIMATIC AX WinCC Unified Elements

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