The September 2023 Issue of PCB007 Magazine Available Now
September 18, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. And then there’s the impact of the CHIPS Act.
In this issue of PCB007 Magazine, we look at materials, advanced packaging and UHDI fundamentals from multiple directions with industry voices ranging from fabricators to equipment manufacturers, to industry advocates.
We also bring you special coverage with conversations from some of the suppliers to the ultra-modern fab and assembly facility in Moscow, Idaho, built by Schweitzer Engineering Laboratories.
Preview this month's issue or download a copy to your library for future reference.
Suggested Items
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Electroninks' MOD and iSAP Game Changers
03/25/2025 | Marcy LaRont, PCB007 MagazineElectroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/07/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?