The September 2023 Issue of PCB007 Magazine Available Now
September 18, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. And then there’s the impact of the CHIPS Act.
In this issue of PCB007 Magazine, we look at materials, advanced packaging and UHDI fundamentals from multiple directions with industry voices ranging from fabricators to equipment manufacturers, to industry advocates.
We also bring you special coverage with conversations from some of the suppliers to the ultra-modern fab and assembly facility in Moscow, Idaho, built by Schweitzer Engineering Laboratories.
Preview this month's issue or download a copy to your library for future reference.
Suggested Items
UHDI Fundamentals: UHDI Applications for Aerospace
08/13/2024 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.
Matrix Introduces Specialty Process Equipment for the UHDI and IC Substrate Market
07/30/2024 | Matrix ElectronicsGlobal expansion for semiconductor chips and the resulting requirement for UHDI and IC Substrate packaging has led to increased investments in PCB manufacturing capacity to support this growth. UHDI and IC packaging manufacturing requires new equipment dedicated to the specification and quality requirements for these product lines.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/19/2024 | Andy Shaughnessy, PCBDesign007Are you ready for the weekend? Fin de semana? I think we all are! In this week’s roundup, we have one article on what it takes to thrive in the industry today, as well as an interview that discusses one student’s drive to succeed as a PCB designer. We also have an article by our newest columnist, Tom Yang, who introduces us to his family-owned PCB company. Columnist Hanna Grace brings us an interview with her mentor, and Anaya Vardya continues his UHDI coverage with an article that explains UHDI’s use in the RF/microwave arena.
UHDI Fundamentals: UHDI for RF Microwave Applications
07/16/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:
UHDI Fundamentals: UHDI Applications for Medical Devices
07/03/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology typically refers to advanced printed circuit board (PCB) manufacturing techniques that allow for a higher density of electronic components and interconnections within a smaller area. While not directly related to medical applications on its own, UHDI technology can indirectly benefit various medical devices and equipment by enabling smaller, more compact designs with increased functionality and performance.