Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SIA Commends Finalization of CHIPS Incentives for TSMC

11/18/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona.

Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona

11/15/2024 | U.S. Chamber of Commerce
TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology

11/14/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act.

Reports Indicate TSMC to Tighten Scrutiny on Chinese AI Chip Clients; Potential Revenue Impact Between 5% to 8%

11/11/2024 | TrendForce
Reports suggest that TSMC has notified its Chinese clients of a temporary suspension on shipments of advanced AI chips produced using 7nm and below process nodes.

SIA Applauds CHIPS Act Incentives for Corning and Powerex

11/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce for Corning and Powerex.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in