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Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave

09/18/2024 | Intel
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

Sondrel Announces Advanced Modelling Process for AI Chip Designs

09/10/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.

Chipsea Charts a Path for Strategic Expansion Through Enhanced Computing Peripherals

09/09/2024 | PRNewswire
Chipsea Technologies (Shenzhen) Corp., Ltd. (Chipsea), in collaboration with Intel, introduced a new line of edge BMC products. Specializing in computing peripheral chips, Chipsea has deepened its technological ties with Intel, creating a comprehensive ecosystem that supports a range of computing from the personal level to the broader edge and cloud applications.

SIA Applauds CHIPS Act Incentives for Texas Instruments Manufacturing Facilities

08/19/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Texas Instruments (TI).

Texas Instruments Secures $1.6B in CHIPS Act Funding for Texas and Utah Semiconductor Manufacturing

08/16/2024 | PRNewswire
Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments.
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