iNEMI LTS Tech Topic Series: Electromigration in Tin-Bismuth Planar Solder Joints

Estimated reading time: 1 minute

iNEMI is launching a series of webinars focused on low temperature solder (LTS). This first webinar in the series will share information from Phase 1 of iNEMI’s Electromigration in SnBi Solder for Second-Level Interconnect project, which is determining the effects of joint height, temperature, current density and PCB finishes on reliability over a product’s life.

The low melting temperature (138°C) of SnBi alloys make it attractive for assembling high-density microelectronic packaging, which is prone to warpage. However, bismuth (Bi) has a high propensity for electromigration and segregation at the anode under high current density conditions, leading to potentially brittle solder joints with high electrical resistance with time in field.

The Phase 1 project team used a planar geometry solder joint test vehicle to study electromigration in low temperature solders such as SnBi. The novelty of their approach is that the planar solder joints bridging copper traces on printed circuit boards allow the metallurgical and electromigration phenomena to be directly and non-destructively observed while monitoring the resistance changes in the solder joints. This webinar will share the team’s observations and analysis of experiment results plus talk about next steps.

Registration

This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content).

Session 1
Tuesday, October 17, 2023
10:00-11:00 a.m. EDT (Americas)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)

Session 2
Wednesday, October 18, 2023
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on October 17