Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Mega Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

07/29/2026 | atg Mycronic GmbH
Atg Mycronic GmbH and IEC USA confirm an order for an atg A7a, 8 head, double-sided, high speed, auto-load/unload system for true “lights-out” operation from Mega Circuit.

Marvell Invests $250M in India to Expand AI Development

07/29/2026 | BUSINESS WIRE
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced plans to invest $250 million in India over the next three years to expand its capabilities across technology, talent and infrastructure.

Amkor, NVIDIA Partner to Expand AI Packaging and Test

07/29/2026 | BUSINESS WIRE
Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms.

Technica USA and DCT Tackle One of the Biggest Challenges in PCB Cleaning

07/29/2026 | Technica USA
As the industry prepares to explore the critical role of cleaning in today’s increasingly complex PCB manufacturing processes, Technica is gearing up for its upcoming Lunch & Learn event, taking place August 12–13, 2026.

CACI Continues Modernization of U.S. Navy’s Military Sealift Command’s Integrated Business Systems

07/28/2026 | CACI International Inc.
CACI International Inc announced that it has been awarded a five-year technology contract valued at up to $113 million by the U.S. Navy’s Military Sealift Command (MSC) to continue modernizing a portfolio of mission-critical business applications used by both ashore personnel and MSC’s global fleet.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in