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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Koh Young Case Study Underlines the Power of Supplier Partnerships with IMI
November 2, 2023 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young has released their latest case study exploring their global partnership with IMI and specifically the success the collaboration has achieved at IMI’s facility in Guadalajara, Mexico.
This case study explores the changing climate for manufacturing in Mexico as volumes and demand increases in the region and manufacturers, including IMI, look to grow through greater automation and closer collaboration with key technology partners like Koh Young. With interviews with Oscar Valdivia, IMI’s Manufacturing Unit Manager for Guadalajara, and Philip Reyes, their Regional Engineering Head, the case study digs into how manufacturing excellence can be developed with the right use of automation and by investing in equipment that creates efficiency and quality through better use of accurate data.
The IMI team also talks about the value of good traceability and the importance of proper software integration with their equipment partners, going on to explore the potential value-add of using AI alongside inspection equipment.
Learn more about IMI at global-imi.com. IMI have Koh Young SPI and AOI and product details are available at kohyoungamerica.com/our-solutions.
You can download the case study at kohyoungamerica.com/case-studies.
FREE downloads from Koh Young:
- The Printed Circuit Assembler's Guide to...SMT Inspection: Today, Tomorrow, and Beyond eBook
- The Companion Guide to…SMT Inspection: Today, Tomorrow, and Beyond eBook
- Why the Need for 3D Solder Paste Inspection article
- How Engineers Can Use SPI Tools for Verification article
- Testing Out an Expert Partnership: Stencil Printing in Cavities article
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Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.