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Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

DOCOMO Develops Solution to Create High-frequency Mobile Cells

01/18/2022 | ACN Newswire
NTT DOCOMO, INC. announced that it has developed an antenna system capable of creating a high-frequency mobile communication cell when a small (roughly one cubic centimeter) piece of plastic is placed on top of a dielectric waveguide.

Waveguides: AT&S Develops Next Generation of Mobile Communications

01/06/2022 | AT&S
What comes after 5G? The Austrian technology company makes an important contribution to the development of tomorrow’s mobile communication and radar technologies and is already working on 6G.

High-Frequency Technology Entirely in Glass

01/25/2021 | LPKF Laser & Electronics
To remain competitive in the field of the Internet of Things, even medium-sized industrial and process metrology companies need to increasingly integrate their sensor circuits into ASICs (application-specific integrated circuits).

DigiLens Brings Ultra-Compact CrystalClear AR HUD to Any Auto Dashboard

09/16/2020 | Globe Newswire
DigiLens Inc., an innovator in holographic waveguide display technology for extended reality (XR), announced the availability of its CrystalClear™ Augmented Reality (AR) Heads-up Display (HUD), boasting the largest field-of-view (FOV) HUD up to 15° x 5° and packaged into approximately 5 liters of volume.
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