Keysight EDA Strengthens Design and Simulation Support for Tower Semiconductor RF Process Technologies
November 16, 2023 | Keysight Technologies, Inc.Estimated reading time: 1 minute

Keysight Technologies, Inc. expanded the simulation capabilities in its Electronic Design Automation (EDA) software suite to include electro-thermal simulation for the Tower Semiconductor SiGe Power Amplifier (PA) process. Together with process design kits (PDKs) for Tower radio frequency (RF) technologies for circuit and physical designs, the new electro-thermal simulation enables integrated circuit (IC) designers to achieve first pass success.
Keysight Advanced Design System (ADS), RFPro, and RFIC Design (GoldenGate) are industry leading platforms for RF and microwave circuit design that help designers address their most difficult challenges with advanced solutions for radio frequency integrated circuit (RFIC), electromagnetic (EM), and electro-thermal simulation. Platform interoperability allows IC designers to access Keysight simulation technologies independent of which schematic or layout environment they use to generate the design.
Tower offers silicon-based analog foundry technologies – silicon germanium (SiGe) for both high-speed and high-power and RF silicon-on-insulator (SOI) – optimized to assist chip suppliers in delivering differentiated RF front-end solutions for increasingly complex devices. Designers employ Tower’s latest PDKs in developing and simulating their RFICs for various applications with Keysight EDA tools.
Dr. Samir Chaudhry, Senior Director of Design Enablement at Tower Semiconductor, said: “Tower has been successfully collaborating with Keysight to solve the most complex RF problems for our customers. Keysight supports our RF PDKs for design and simulation in ADS with accurate electromagnetic analysis in RFPro. Enablement of Keysight’s differentiated electro-thermal solution in ADS for Tower’s SiGe PA processes is a welcome move that is already helping RF SiGe customers perform accurate thermal analyses of their designs.”
Nilesh Kamdar, Senior Director and RF/Microwave Portfolio Manager at Keysight, said: “Keysight and Tower have been partnering for more than a decade to enable our mutual customer design flows with advanced RF solutions, helping them to achieve faster time-to-market. This year, our partnership achieved another milestone by providing electro-thermal simulation capability for Tower’s RF SiGe processes as part of ADS. Using this new capability, customers can ensure that their ICs perform within acceptable operating temperatures prior to manufacturing.”
Suggested Items
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
04/09/2025 | Real Time with...IPC APEX EXPOPeter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
The Shaughnessy Report: Always With the Negative Waves
04/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I started covering PCB design in the ‘90s, RF designers comprised a small percentage of the design community. Other than cellphones and handheld GPS devices, RF wasn’t seen very often outside of military, aerospace, and law enforcement applications. Now, RF is everywhere. Almost every electronic device in your house and pocket—your cellphone, tablet, laptop, smartwatch, and wireless/smart speaker—contains RF technology. The entire wearable segment is built on RF technology
Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
04/08/2025 | SiemensSiemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.
Designing Through the Noise: April 2025 Design007 Magazine
04/08/2025 | I-Connect007 Editorial TeamIn the April 2025 issue of Design007 Magazine, our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
A Look Into the Future With Futurist Kevin Surace
04/07/2025 | Barry Matties, I-Connect007In this interview after his keynote address at IPC APEX EXPO 2025, futurist Kevin Surace reflects on important lessons learned and how they shaped his own future. He also makes some bold predictions for the use of AI in PCB board design, fabrication, and assembly—and what the common household will look like in 10 years. It’s an exciting and adventurous step into a future where humans work alongside robots, all for the betterment of everyone.