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Benchmark Celebrates Expansion of World-Class Facility in Brasov, Romania

07/26/2024 | PRNewswire
Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, celebrated the opening of its significantly expanded presence in Brasov, Romania, continuing the company's investment in the region.

iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends

07/26/2024 | iNEMI
Modern day computing needs, notably AI/machine learning and high-performance computing, along with their subsequent memory and I/O requirements, are fueling an increased demand for semiconductor devices with higher performance, lower power consumption and latency as well as reduced footprint.

Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project

07/25/2024 | PRNewswire
Altair, a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the U.K.-based University of Nottingham for a digital twin project within the aerospace sector.

Collins Aerospace Relocating Singapore Plant to New $250M Manufacturing Facility in Seletar Aerospace Park, Singapore

07/25/2024 | Collins Aerospace
Collins Aerospace, an RTX business, announced the relocation of its Singapore manufacturing facility to a new, state-of-the-art site in Seletar Aerospace Park, Singapore.

ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

07/24/2024 | ASMPT
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.
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