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See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025

05/28/2025 | TopLine
Aerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.

Honda to Co-develop Refueling Port Connecting System for On-orbit Satellite Refueling with Astroscale

05/30/2025 | JCN Newswire
Honda R&D Co., Ltd., a research and development subsidiary of Honda Motor Co., Ltd., will co-develop a refueling port connecting system designed for on-orbit refueling of satellites, with Astroscale Japan Inc., a subsidiary of Astroscale Holdings Inc.

Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains

05/29/2025 | Siemens
Siemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.

Standards: The Roadmap for Your Ideal Data Package

05/29/2025 | Andy Shaughnessy, Design007 Magazine
In this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.

Rocket Lab Enters Payload Market with Agreement to Acquire Geost

05/28/2025 | BUSINESS WIRE
Rocket Lab Corporation, a global leader in launch services and space systems, today announced the signing of a definitive agreement to acquire the parent holding company of Geost, LLC (Geost).
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