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Meet the IPS Workforce: Inoa Wahinehookae
December 11, 2023 | Barry Matties, I-Connect007Estimated reading time: 1 minute
As the workforce continues shifting to the next generation and the lack of appeal for manufacturing careers persists, we feel it’s important to share the voices of those who have chosen manufacturing as their career. We believe this will raise awareness and inspire others to consider manufacturing as a strong and viable career path.
I recently went to Cedar City, Utah, where I visited IPS, which has been manufacturing wet process equipment for printed circuit board fabrication for over 30 years. While there, I conducted candid one-on-one interviews with several of the IPS team members, who shared their views on manufacturing, as well as their roles, challenges, and advice for others looking at manufacturing as a career.
In this video, you will meet mechanical design engineer Inoa Wahinehookae, who graduated two years ago from Southern Utah University with a bachelor’s degree in mechanical engineering and a minor in CAD/CAM. He started his career with IPS, and now, as project manager, Inoa is already in charge of some of the largest projects at IPS. His current project is a state-of-the-art, fully automated ENEPIG line that will soon be installed at TTM. Inoa has been the project manager from the start of the entire process and will be onsite for the installation and customer training.
To read this entire article, click here. Watch the interview with Inoa below.
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Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology
11/14/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2
11/14/2024 | I-Connect007 Editorial TeamThe guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.