Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Wafer-Level Packaging Symposium Program Announced
December 13, 2023 | SMTAEstimated reading time: Less than a minute
The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The Hyatt Regency San Francisco Airport in San Francisco, California.
The technical program includes over 25 expert speakers who delve into wafer-level packaging advances, 3D wafer-level integration, advanced packaging inspection, materials innovation, fan-out wafer-level packaging and manufacturing excellence. The program features presentations from leading companies including Intel Corporation, KLA Corporation, Department of Defense, and more.
Additionally, the technical program features two keynote presentations. On Tuesday, February 13, 2024, Manish Dubey, Ph.D., AMD, will present, “Advanced Packaging: Key Enabler for AI.” On Wednesday, February 14, 2024, Benjamin S. Cook, Meta, will present, “Wafer-Level Fan Out Technology Options to Realize High-Performance AI Enabled Augmented Reality (AR) Wearable Devices.”
The symposium will culminate with two professional development courses on Thursday, February 15, 2024. The first course, “Polymers for Wafer-Level Packaging,” will be instructed by Jeff Gotro, Ph.D., InnoCentrix, LLC, from 8:30 am – 12:00 pm (PST). Tom Dory, Ph.D., Fujifilm Electronic Materials, will instruct the second course, “Package Assembly Processes and Technology,” from 1:00 pm – 4:30 pm (PST). Access to the courses is included in standard registration.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.