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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Real Time with... productronica 2023: ViTrox's Robotic Final Inspection Solution Offers User Flexibility
December 13, 2023 | Real Time with...productronicaEstimated reading time: Less than a minute
Fahmi Helmi of ViTrox highlights their advanced robotic vision solution, V9i. Its multi-angle views, with both rule-based and self-learned algorithms, makes it ideal for various inspection needs.
If you were unable to attend productronica 2023, don't worry. We're bringing you coverage of many of the week's events in Munich.
Watch this interview below or click here to view on our Real Time with... productronica 2023 show page.
Suggested Items
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
04/28/2025 | PRNewswireNEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
04/28/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ITRI Named a Top 100 Global Innovator for the Ninth Time
04/28/2025 | PRNewswireThe Industrial Technology Research Institute (ITRI) was officially honored at the 2025 Top 100 Global Innovators Award Ceremony hosted by Clarivate in Taipei.
Airbus Signs Definitive Agreement with Spirit AeroSystems
04/28/2025 | AirbusAirbus SE has entered into a definitive agreement with Spirit AeroSystems for the acquisition of industrial assets dedicated to its commercial aircraft programmes.