Arrow Electronics Establishes High-Power Centre of Excellence in UK to Accelerate Electrification and Sustainability
December 13, 2023 | Arrow ElectronicsEstimated reading time: 1 minute
Arrow Electronics, Inc., a global provider of technology solutions, and its engineering services company, eInfochips, have announced the establishment of a High-Power Centre of Excellence (CoE) in Swindon, United Kingdom. The purpose of this High-Power CoE is to assist customers in the development of high-power solutions, a critical component in advancing electrification and sustainability initiatives.
High-power designs play a pivotal role in achieving energy efficiency, making them essential for various net-zero projects such as electric vehicles, renewable energy, battery storage, grid infrastructure, and other applications. However, the complexities associated with high-power electronics design, including lack of power expertise, stringent functional safety and reliability requirements, intricate PCB layout, and the necessity for costly testing equipment, pose challenges for innovators.
Arrow Electronics' High-Power CoE is strategically positioned to address these challenges. Leveraging its extensive high-voltage design experience, the CoE is equipped with a high-power lab in Swindon and an experienced engineering team from eInfochips. The goal is to empower innovators to navigate the complexities of high-power electronics design effectively.
"The ever-increasing focus on decarbonization is driving electrification. High-voltage electronics is a key enabler, and in Arrow Electronics, customers have a reliable team member to help them navigate this energy transition journey effectively," said Murdoch Fitzgerald, vice president, global engineering and design services at Arrow Electronics. "The Swindon facility is known for its configurable power supply capabilities, and the CoE builds on its legacy by investing in new equipment and engineering talent. We can now offer turnkey design services from the Swindon facility."
The High-Power CoE will design innovative and leading-edge products for all customers of Arrow and its subsidiaries, such as Richardson RFPD. By accelerating and de-risking design cycles, leveraging the power equipment in Swindon, and accessing a world-class engineering talent, customers can effectively plan and manage their high-power product roadmap and lifecycles.
Suggested Items
TRI: Inspection Innovations at Focus on PCB Expo
04/09/2025 | TRII-Tronik, TRI's distributor, will showcase cutting-edge AI-powered inspection solutions at Focus on PCB 2025, taking place at Fiera di Vicenza, Italy, from May 21–22, 2025.
DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications
04/08/2025 | RanovusCerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA), for the development of a state-of-the-art high-performance computing system. The Cerebras system will combine the power of Cerebras’ wafer scale technology and Ranovus’ wafer scale co-packaged optics to deliver several orders of magnitude better compute performance at a fraction of the power draw.
BAE Systems to Power New Hybrid-electric Bus Fleet in San Francisco
04/08/2025 | PRNewswireBAE Systems (LON:BA), a leader in heavy-duty electric propulsion, will provide 42 electric drive systems for the San Francisco Municipal Transportation Agency's (SFMTA) new fleet of hybrid-electric buses.
epoxySet Introduces EC-1019 – Thermally Conductive, Crack Resistant Epoxy Potting
04/07/2025 | epoxySetepoxySet introduces the EC-1019, specialized epoxy potting compound. This system utilizes unique chemistry and fillers to offer a thermally conductive compound that has very small particulate size of about 15um.
IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.