The New Chapter: Navigating Maternity Leave in the Electronics Industry
American Made Advocacy: There's No Substitute for American-made Microelectronics
It’s Only Common Sense: When Will Big Companies Start Paying Their Bills on Time?
Recent Practices in PCB Fab Registration System Architecture
December 13, 2023 | Alex Stepinski, Stepinski GroupEstimated reading time: Less than a minute
The registration of copper features, both to interconnects and to each other, is a topic about which documented cases in the public space are less than abundant, other than individual supplier marketing with minimal back-up data. Traditionally, this area is known to individual fabs as it involves multiple processes with a lot of variation in equipment makes/models, and even base materials between different shops. This article endeavors to document the current Pareto frontier of registration system design architecture for use by PCB fab engineers.
In general, registration system design involves managing the interaction of the bill of materials and the bill of process relative to feature alignment. The bill of process involves the equipment, associated procedures, and sequence of operations. The bill of materials involves the materials and tooling files specified in the ERP documentation.
To read this entire article, which appeared in the November 2023 issue of PCB007 Magazine, click here.
Share on:
Suggested Items
BWXT to Acquire L3Harris’ A.O.T. Business to Expand Special Materials Portfolio
11/05/2024 | L3Harris TechnologiesBWX Technologies, Inc. and L3Harris Technologies, Inc. announced the signing of a purchase agreement for BWXT to acquire L3Harris’ Aerojet Ordnance Tennessee, Inc. (A.O.T.) business for approximately $100 million.
Solid-State Batteries Enter Pilot Production, Costs Expected to Drop to CNY 0.6–0.7/Wh by 2035
11/01/2024 | TrendForceThe global pursuit and anticipation of applications for solid-state batteries (SSBs) have accelerated the commercialization process of this technology.
Robots in Logistics Boom Worldwide
10/31/2024 | BUSINESS WIREThe demand for robots for transport and logistics is increasing: Almost 113,000 robots were sold for transport and logistics tasks in 2023 – up 35%. These results are published by VDMA Materials Handling and Intralogistics Association in cooperation with the IFR.
Machine Learning Can Predict the Mechanical Properties of Polymers
10/30/2024 | ACN NewswirePolymers such as polypropylene are fundamental materials in the modern world, found in everything from computers to cars. Because of their ubiquity, it’s vital that materials scientists know exactly how each newly developed polymer will perform under different preparation conditions.
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.