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Recent Practices in PCB Fab Registration System Architecture
December 13, 2023 | Alex Stepinski, Stepinski GroupEstimated reading time: Less than a minute

The registration of copper features, both to interconnects and to each other, is a topic about which documented cases in the public space are less than abundant, other than individual supplier marketing with minimal back-up data. Traditionally, this area is known to individual fabs as it involves multiple processes with a lot of variation in equipment makes/models, and even base materials between different shops. This article endeavors to document the current Pareto frontier of registration system design architecture for use by PCB fab engineers.
In general, registration system design involves managing the interaction of the bill of materials and the bill of process relative to feature alignment. The bill of process involves the equipment, associated procedures, and sequence of operations. The bill of materials involves the materials and tooling files specified in the ERP documentation.
To read this entire article, which appeared in the November 2023 issue of PCB007 Magazine, click here.
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ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.