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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Recent Practices in PCB Fab Registration System Architecture
December 13, 2023 | Alex Stepinski, Stepinski GroupEstimated reading time: Less than a minute

The registration of copper features, both to interconnects and to each other, is a topic about which documented cases in the public space are less than abundant, other than individual supplier marketing with minimal back-up data. Traditionally, this area is known to individual fabs as it involves multiple processes with a lot of variation in equipment makes/models, and even base materials between different shops. This article endeavors to document the current Pareto frontier of registration system design architecture for use by PCB fab engineers.
In general, registration system design involves managing the interaction of the bill of materials and the bill of process relative to feature alignment. The bill of process involves the equipment, associated procedures, and sequence of operations. The bill of materials involves the materials and tooling files specified in the ERP documentation.
To read this entire article, which appeared in the November 2023 issue of PCB007 Magazine, click here.
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Creating a Design Constraint Strategy
07/24/2025 | I-Connect007 Editorial TeamMost designers learn how to set their design constraints through trial and error. EDA vendors’ guidelines explain how to use their particular tools’ constraints, and IPC standards offer a roadmap, but PCB designers usually develop their own unique styles for setting constraints. Is there a set of best practices for setting constraints? That’s what I asked Global Electronics Association design instructor Kris Moyer, who covers design constraints in his classes.
Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
07/23/2025 | I-Connect007In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (DuPont's electronics business), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.