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Recent Practices in PCB Fab Registration System Architecture
December 13, 2023 | Alex Stepinski, Stepinski GroupEstimated reading time: Less than a minute
The registration of copper features, both to interconnects and to each other, is a topic about which documented cases in the public space are less than abundant, other than individual supplier marketing with minimal back-up data. Traditionally, this area is known to individual fabs as it involves multiple processes with a lot of variation in equipment makes/models, and even base materials between different shops. This article endeavors to document the current Pareto frontier of registration system design architecture for use by PCB fab engineers.
In general, registration system design involves managing the interaction of the bill of materials and the bill of process relative to feature alignment. The bill of process involves the equipment, associated procedures, and sequence of operations. The bill of materials involves the materials and tooling files specified in the ERP documentation.
To read this entire article, which appeared in the November 2023 issue of PCB007 Magazine, click here.
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