Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Omnitron Sensors Unlocks $6.3B LiDAR Market for Autonomous Navigation in Cars and Robotics
December 15, 2023 | BUSINESS WIREEstimated reading time: 2 minutes
The market for light detection and ranging (LiDAR) subsystems is surging toward $6.3B by 20271, in part driven by the automotive industry’s thirst for a precise optical technology that provides real-time 3D vision in all weather and lighting conditions. Omnitron Sensors, a semiconductor startup co-founded by a team with roots at Tesla and Google, announced a series of milestone achievements in targeting this massive market with the first microelectromechanical systems (MEMS) step-scanning mirror that meets the rigors of LiDAR in automotive advanced driver assistance systems (ADAS), robotic cars and aerial drones.
Fueled by its lead investor L’ATTITUDE Ventures, an investor in early-stage US Latina(o)-owned startups with high-growth potential, Omnitron has raised a total of $11M in venture capital since its founding in 2019.
Oscar Munoz, former CEO and chairman of United Airlines and a general partner at L’ATTITUDE Ventures, cited the unique attributes of Omnitron Sensors Co-founder & CEO Eric Aguilar in expanding his firm’s investment in the company.
“Eric’s technical experience in developing sensors, combined with his leadership experience in building autonomous systems for companies such as Tesla — where he led a team of 300 engineers building the firmware for Model 3 — and X, where he helped to develop the autonomous-delivery drone service, Google project Wing, make Omnitron a company to watch,” said Munoz.
In late Q3 2023, Omnitron revealed Silex Microsystems — the world’s largest pure-play MEMS foundry — as its foundry partner, signifying market-readiness to deliver the first MEMS scanner that meets the accuracy, reliability, size, cost and volume requirements of LiDAR in diverse applications. See press release: Omnitron Sensors Selects Silex Microsystems for Reliable MEMS Scanner for LiDAR (September 12, 2023).
Omnitron has also forged partnerships with key players in the LiDAR ecosystem — established suppliers that are eager to use Omnitron’s MEMS mirror in their systems.
“As the first MEMS mirror that aligns to a LiDAR system’s sub-micron-level tolerances without constant recalibration — and which is priced for cars instead of billion-dollar satellites — Omnitron’s sensor has attracted the attention of tier 1 automotive suppliers,” said Aguilar. “With the capital in hand to manufacture our MEMS mirror and with Silex as our proven high-volume foundry partner, we’ve cleared the way to satisfy future demand from LiDAR suppliers.”
As a tech entrepreneur increasingly recognized on the global stage, Aguilar presented at two prestigious innovation conferences during the past year. He engaged with an international community of business leaders at the Bogotá Chamber of Commerce (BCC) and the ICC World Chambers Federation (WCF) conference in Bogotá, Colombia on March 1, 2023. On November 2, 2023, he addressed an audience of innovators from global corporations and fast-growth businesses at Dubai Business Forum 2023 in Dubai, UAE.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.