AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins MiniLED Materials Award at Hangjia
December 15, 2023 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the Most Influential MiniLED Materials Award at the recent Hangjia Aurora Awards Ceremony. This prestigious accolade was presented during the annual Mini/Micro LED Conference held in Hangjia, China.
The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter, setting a new industry standard in miniaturization and precision.
Key features of the NC259FPA Ultrafine No Clean Solder Paste include:
- Excellent Wetting: Ensures strong, reliable joints for long-term performance.
- High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
- High Reliability: Meets the rigorous standards required in high-performance electronics manufacturing.
- High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.
The award highlights AIM Solder’s commitment to advancing solder technology and its dedication to supporting the evolving needs of the electronics manufacturing sector.
“We are thrilled to receive this award," said Michael Zou, Lighting and Display Business Manager at AIM Solder. "The NC259FPA paste represents a feat of innovation. We’ve been very proud of its performance and the results our customers are seeing with it.”
Suggested Items
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs
10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel CorporationAs CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. SwaminathanNear-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.
SMTA Carolinas Chapter Hosts Expert-Led Webinar: “Mastering Solder Paste Printing for Optimal SMT Assembly”
09/24/2024 | Koh YoungThe SMTA Carolinas Chapter invites you to attend an informative webinar on "Mastering Solder Paste Printing for Optimal SMT Assembly" on Tuesday, October 15, 2024, from 12:00 PM to 1:00 PM (Eastern).
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.