Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Asia-Pacific AI Infrastructure Spending to Reach US$32B by 2030

11/10/2026 | IDC
AI infrastructure spending in the Asia/Pacific excluding Japan and China (APeJC) region is entering its next phase of growth.

Inspectis Launches XYZ Motorized Positioning System

11/09/2026 | INSPECTIS AB
Inspectis AB has introduced an XYZ Motorized Positioning System for its precision digital microscope systems, it is announced today, and will exhibit the new product at the ELECTRONICA show in Munich, Germany, in Stand A4.124.

Polar, IC-Link by imec Partner on 8-Inch GaN Manufacturing

10/19/2026 | Polar Semiconductor, LLC
Polar Semiconductor, LLC (Polar), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, announced they are collaborating to provide 8-inch production of enhancement-mode (e-mode) GaN devices to serve critical markets such as AI data centers, automotive, aerospace & defense, and the industrial grid.

Calumet Electronics Names Dr. Meredith LaBeau President and CTO

10/19/2026 | Calumet Electronics
Calumet Electronics announced the promotion of Dr. Meredith LaBeau to President and Chief Technology Officer, effective November 1, the start of the company’s fiscal year.

Wolfspeed Secures Conditional $1.5B U.S. Defense Loan Commitment

10/14/2026 | Wolfspeed
Wolfspeed, Inc. announced it has received a conditional loan commitment letter from the U.S. Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in