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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing

09/14/2026 | USI
USI announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, and smart factory initiatives

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.

HyperLight Welcomes VentureTech Alliance to Series C

09/09/2026 | BUSINESS WIRE
HyperLight Corporation, a leader in thin-film lithium niobate (TFLN) photonics, announced that VentureTech Alliance (VTA) has joined its Series C financing round.

HUMAIN, Compal Partner to Expand Cloud-to-Edge AI at LEAP 2026

09/01/2026 | Compal Electronics Inc.
As artificial intelligence rapidly expands beyond centralized cloud computing into real-world applications, HUMAIN has selected Compal Electronics as its long-term strategic ODM partner to support the development and manufacturing of its next-generation AI infrastructure and intelligent computing platforms.

Qnity Introduces Stackplane CMP Slurry Platform for Advanced Packaging

08/31/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).
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