iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based Low-Temperature Solder Joints

Estimated reading time: 1 minute

There is an increasing interest in some market segments to use solder alloys with lower melting temperatures for electronics assembly. Low-temperature solder (LTS) can provide manufacturing, economic, and environmental benefits. Since 2015, the iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability project has been evaluating LTS paste formulations based on the Bi-Sn system. This webinar will report the results and lessons learned from the thermal cycling tests of low-temperature solders completed to date on three types of LTS solder joints: homogeneous, hybrid (heterogeneous), and hybrid formed with joint reinforced pastes (JRP).  Get additional details about testing to be discussed in this webinar.

About the Speaker

Richard Coyle, Consulting Member of the Technical Staff, Nokia Bell Labs    

Richard Coyle, PhD, is widely recognized in the industry for his expertise in metallurgy and electronics material science. He began his career at Bell Labs approximately 30 years ago with research spanning areas such as laser and electronics materials processing. His work on the reliability and the critical understanding of the structural property relations of solders is well recognized across the industry. He currently leads root cause analyses, advanced reliability risk assessments, attachment reliability testing of electronic assemblies, and experimental studies of emerging Pb-free solder alloys as part of the Nokia Bell Labs Reliability organization. He received his Ph.D. in Metallurgical Engineering and Materials Science from the University of Notre Dame.

Registration

This webinar is open to industry; advance registration is required (see links below). Two sessions are scheduled (with the same content).