-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
ITRI, Intel Taiwan Unveil Cutting-Edge Joint Lab for HPC Cooling Certification
February 1, 2024 | ITRIEstimated reading time: 1 minute
ITRI and Intel Taiwan have inaugurated the ITRI-Intel Joint Lab for HPC Cooling Certification. This facility is dedicated to the development and validation of industrial immersion cooling solutions for high-performance computing. Targeting liquid cooling technology, the lab offers comprehensive verification services, including materials property testing, compatibility assessments with server components, and service life cycle evaluations. A letter of intent was signed between Intel Taiwan and ITRI.
Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at ITRI, emphasized the critical need for enhancing data center efficiency while reducing energy consumption. “According to the International Energy Agency, the energy consumption of data centers around the world ranged from 0.9% to 1.3% of total electricity consumption in 2022, with carbon emissions accounting for 0.3%. The global proliferation of data centers, driven by the surging demand for data volume and transmission speed, underscores the urgency of our mission,” he stated.
Tzong-Ming Lee, Vice Present President and General Director of Material and Chemical Research Laboratories of ITRI, states that compared to the conventional data center devices, the immersion cooling technology can dissipate the heat from components to liquid coolant with no other active cooling devices, which could reduce 45% of the carbon emission and become one of the best heat dissipation options. ITRI is developing the single-phase immersion coolant technology with the features of extremely low energy consumption and fluoride-free, aligning with the requirements of EU legislation.
Grace Wang, Intel Vice President in the Sales, Marketing and Communications Group and General Manager of Intel Taiwan, affirmed Intel’s commitment to sustainable solutions for enterprises. “Our recently launched Open IP Immersion Cooling Solutions were designed to enhance operational efficiency. As a leader in data center innovation, Intel is collaborating with ITRI to explore further advanced immersion cooling technology. ITRI’s active support in providing real-world machine verification and testing platforms will facilitate the industrial adoption of the technology. Through this collaboration, we aspire to promote advanced cooling solutions within Taiwan’s supply chain, contributing to the realization of sustainable data centers.”
Suggested Items
GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25
12/18/2024 | TrendForceAs the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.
Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24
11/25/2024 | Compal Electronics Inc.Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
Jabil Acquires Mikros Technologies
10/03/2024 | BUSINESS WIREJabil Inc., a global leader in design, manufacturing, and supply chain solutions, announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025,
09/23/2024 | TrendForceTrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025.