ASMC 2024 to Spotlight Advanced Semiconductor Manufacturing Innovations and Excellence
February 12, 2024 | SEMIEstimated reading time: 1 minute
Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in manufacturing enabling AI and advancing technology nodes will take center stage at the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York. Expected to draw hundreds of attendees from across the industry, the 35th annual ASMC will feature over 30 hours of technical and poster presentations by more than 120 industry experts on the latest manufacturing strategies and methodologies. Registration is now open.
ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Bradley Wood, Applications Engineering Manager, CMP Filtration at Entegris, and Vijayalakshmi Seshachalam, CVD Process Engineer Lead at GlobalFoundries.
ASMC 2024 technical sessions will cover topics including:
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Patterning / Design for Manufacturability / Design-Technology Co-Optimization
- Advanced Process Control
- Big Data Management and Mining
- Contamination Free Manufacturing
- Defect Inspection and Reduction
- Discrete and Power Devices
- Equipment Optimization
- Factory Automation
- Industrial Engineering
- Innovative Silicon Devices and Processes
- Lean Manufacturing
- Manufacturing for Sustainability
- Non-silicon and Non-CMOS
- Packaging and Through Silicon Via
- Smart Manufacturing
- The Fabless Experience
- Workforce Development
- Yield Enhancement/Learning
- Yield Methodologies
ASMC will also feature the panel discussion: Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce. Panelists will include:
- Moderator: Shari Liss, Executive Director, SEMI Foundation
- Penny Hill, VP of Community, Professional and Workforce Development, Hudson Valley Community College
- Kevin Younis, COO and Executive Deputy Commissioner, Empire State Development
- Kylie Patterson, Senior Advisor, CHIPS for America
The Women in Semiconductors (WiS 2024) program takes place May 16 in conjunction with ASMC 2024. The program will address the importance of promoting diversity and inclusion in the workplace. Complimentary registration is available for ASMC attendees.
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.