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Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds

12/04/2024 | Dana Korf -- Column: Dana on Data
Imagine the day when placing components and routing signal traces and power planes are not constrained by 2D PCB fabrication processes and materials. Astronauts working on the space station have equipment mounted on all axes. They are not constrained by having to stand on a flat surface. They already have a 3D printer at the space station. Why can’t we create PCBs in a 3D space?

AI and Interactive Demand to Drive Humanoid Robot Market Value Beyond $2 Billion by 2027

12/01/2024 | TrendForce
TrendForce’s latest findings show that the global humanoid robot market is expected to surpass US$2 billion in value by 2027, supported by major robotics manufacturers gradually achieving mass production by 2025.

Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design

11/26/2024 | John Watson -- Column: Elementary, Mr. Watson
The infamous "rules of thumb" are simple guidelines that help you make decisions based on experience, not exact facts. They’re like shortcuts we use because they work most of the time. For example, if you want to know if spaghetti is done cooking, a common rule of thumb is to grab a spaghetti strand and throw it against the wall to see if it sticks. I used to do that, except that instead of the wall, I used the ceiling, which drove my mother crazy.

Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities

11/20/2024 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
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