Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Driving Innovation: Direct Imaging vs. Conventional Exposure

07/01/2025 | Simon Khesin -- Column: Driving Innovation
My first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.

Scanfil Strengthens its Customer Portfolio in Medtech & Life Science by Signing Agreement with Liquid Instruments

06/27/2025 | BUSINESS WIRE
Scanfil and Liquid Instruments have signed a manufacturing outsourcing agreement for Scanfil’s Melbourne plant in Australia. This agreement supports Liquid Instruments’ strategy to onshore production of its flagship Moku platform, strengthening domestic supply chains and bringing manufacturing closer to its research and development hub.

Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability

06/26/2025 | MAGNALYTIX
Magnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.

Connect the Dots: The Future of PCB Design and Manufacturing

07/02/2025 | Matt Stevenson -- Column: Connect the Dots
For some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.

Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3

06/25/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Tin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in