Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Indium Experts to Present at International Electronics Manufacturing Technology Conference

10/15/2024 | Indium Corporation
Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.

Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors

10/10/2024 | BUSINESS WIRE
Keysight Technologies, Inc. introduces a 4881HV High Voltage Wafer Test System expanding its semiconductor test portfolio. The solution improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test.

Kensington Electronics Announces New Partnership with ENNOVI

10/09/2024 | Kensington Electronics
In the ever-evolving world of technology, partnerships play a crucial role in driving innovation and growth. Kensington Electronics, Inc. has recently announced an exciting new partnership with ENNOVI, a leading provider of cutting-edge solutions in the electronics industry.

Alpha, Omega Semiconductor Announces Application-Specific EZBuck™ Regulator Designed to Power Intel Arrow Lake Platform

10/09/2024 | Alpha
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, announced its new application-specific EZBuck™ Regulator.

Inflection AI, Intel Launch Enterprise AI System

10/07/2024 | Intel
Inflection AI and Intel announced a collaboration to accelerate the adoption and impact of AI for enterprises as well as developers. Inflection AI is launching Inflection for Enterprise, an industry-first, enterprise-grade AI system powered by Intel® Gaudi® and Intel® Tiber™ AI Cloud (AI Cloud), to deliver empathetic, conversational, employee-friendly AI capabilities and provide the control, customization and scalability required for complex, large-scale deployments.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in