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Cost-optimize Your PCB Design and Specifications

08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE Group
Knowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.

UHDI Fundamentals: UHDI Applications for Aerospace

08/13/2024 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.

Happy’s Tech Talk #31: Novel Ultra HDI Architectures

08/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra HDI has become the focus for many fabricators, especially as the follow-on for the 40-year-old conventional HDI. But there is more to UHDI than just finer traces and spaces. Novel architectures have been developed that complement the new dense lithography. One of the major advantages of HDI, and especially ultra HDI, is the miniature features of the process. Since the microvias and lands are so small, they can be swung around at various angles between the BGA lands. The angles and distances will depend on the BGA pitch and where the microvia is placed relative to the BGA SMT land.

Matrix Introduces Specialty Process Equipment for the UHDI and IC Substrate Market

07/30/2024 | Matrix Electronics
Global expansion for semiconductor chips and the resulting requirement for UHDI and IC Substrate packaging has led to increased investments in PCB manufacturing capacity to support this growth. UHDI and IC packaging manufacturing requires new equipment dedicated to the specification and quality requirements for these product lines.

MKS’ Atotech and ESI Participate in Electronics Circuit Asia in Thailand

07/25/2024 | Atotech
MKS Instruments announces its participation at the Electronics Circuit Asia 2024 in Thailand, July 24-26, highlighting its leading brands Atotech® and ESI® and related advances in advanced packaging, package substrate, and printed circuit board manufacturing.
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