Keysight, AMD Break Barriers to Redefine Benchmarking for Cloud and Edge Infrastructure Performance
March 6, 2024 | Keysight TechnologiesEstimated reading time: 2 minutes
Keysight Technologies, Inc. leveraged 4th generation AMD EPYC™ CPUs from Advanced Micro Devices, Inc. to develop an industry first benchmarking methodology that redefines the landscape of system performance evaluation for high-speed digital designers, network equipment manufacturers, and data center operators.
The deployment of mobile and 5G private networks is expected to grow rapidly across many industries as part of their automation and digital transformation strategy. This diverse set of industry use cases requires a versatile compute architecture that can simultaneously support millions of low-latency, high-bandwidth devices, and a multifaceted workload profile. Given this transformation, comprehensive infrastructure benchmarking is critical to ensure optimal performance across a spectrum of industry use cases.
To provide more realistic performance benchmarks, Keysight in collaboration with AMD developed an integrated test case methodology that takes into account the processing power of central processing units (CPUs). Using realistic traffic emulation, this novel approach enables data center operators to extract more performance from a chosen CPU and to characterize the performance across multiple vectors while adhering to bandwidth requirements. The methodology was developed by deploying Keysight's software tools onto AMD EPYC™ processors to conduct staged test cases with realistic traffic at scale.
Highlights of the test case methodology include:
- Infrastructure scalability – In settings such as smart grids and smart manufacturing, smooth and reliable operation requires handling millions of concurrent devices. Traditional benchmarks frequently overlook the CPU's capacity and its capability to handle a considerably higher concurrent load as the network's bandwidth constraints obscure this ability. This new benchmarking approach is designed to uncover the true CPU power and scalability in these environments.
- Real-life authenticity – Mobile and 5G private networks support specialized fields like vision-based smart manufacturing, extended reality (XR) viewership, and retail workflows. Testing infrastructure for its capability to handle realistic application, voice, and video traffic is crucial. The new benchmark emphasizes replicating bulk activities with millions of devices establishing new sessions and including highly realistic scenarios like subscribers initiating voice, video, and web calls. This insight into real-world capabilities empowers data center operators to provision their infrastructures accurately.
Raghu Nambiar, Corporate Vice President, Data Center Ecosystems and Solutions, AMD, said: "5G mobile network operators worldwide are facing an unprecedented demand for bandwidth. This consistent growth of data traffic volume requires scalable and effective benchmarking solutions to accurately measure user experience. Our collaboration with Keysight demonstrates the ability of AMD EPYC CPUs to deliver impressive parallel processing performance to handle these high volumes of data traffic."
Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight said: "Single dimension benchmarking methodologies like throughput are insufficient for data center operators to properly design and deploy their compute infrastructure. New performance benchmarking is needed in the modern mobile and 5G private networks. When used, it highlights the prowess of the AMD 'Zen 4' chiplet architecture to meet complex demands in those networks."
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
07/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsIf you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.