onsemi Aligns Business Groups to Expand Product Portfolio and Accelerate Growth
March 13, 2024 | onsemiEstimated reading time: 1 minute
onsemi announced the formation of the Analog and Mixed-Signal Group (AMG) which will be led by newly appointed group president, Sudhir Gopalswamy. The group will be focused on expanding onsemi’s portfolio of industry-leading power management and sensor interface devices to unlock an additional $19.3 billion total addressable market and accelerate the company’s growth in the automotive, industrial and cloud-end markets.
Additionally, Simon Keeton has been promoted to group president of the Power Solutions Group (PSG). His leadership has been instrumental in delivering more than $4 billion in total revenue last year, while ramping a profitable silicon carbide business that achieved over $800 million in revenue in 2023.
“This organizational alignment builds on our strength in delivering highly differentiated and optimized solutions focused on customer needs,” said Hassane El-Khoury, president and chief executive officer of onsemi. “With Simon and Sudhir’s industry expertise and proven track records, we are setting the foundation for further growth and leadership in intelligent power and sensing technologies.”
AMG specializes in the development of a range of power management ICs and high precision, low power sensor interfaces and communications products. It positions onsemi to become a full suite provider of high efficiency power tree solutions with an expanded portfolio of gate drivers, DC-DC converters, multi-phase controllers, eFuses and more. The group will continue to extend its leadership in automotive- and industrial-focused sensor interface and communication solutions such as inductive, ultrasonic and medical sensing, as well as single-pair Ethernet and Bluetooth® Low Energy (Bluetooth LE) solutions.
AMG combines the former Advanced Solutions Group (ASG) and Integrated Circuits Division (ICD), previously a part of the PSG. Gopalswamy will oversee both AMG and Intelligent Sensing Group (ISG), which together drove nearly $4 billion in revenue for the company last year.
This strategic move accelerates onsemi’s position and will add even more system value for customers by powering every architecture with analog and mixed-signal technologies that enable advanced functionality, higher performance and faster time to market.
onsemi will publish its first quarter 2024 earnings based on the reorganized business segments and provide comparable historical data.
Suggested Items
Indium Joins Virginia Tech Center for Power Electronics Systems Industry Consortium
06/03/2025 | Indium CorporationIndium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia Tech’s Center for Power Electronics Systems (CPES), an industry consortium that supports power electronics initiatives to reduce energy use while growing capability.
SES’s O3b mPOWER System Receives Platinum Space Sustainability Rating
06/03/2025 | BUSINESS WIREO3b mPOWER, SES’s second-generation medium earth orbit (MEO) system, has been awarded the Platinum badge by the Space Sustainability Rating (SSR) Association.
Rolls-Royce to Provide Power, Handling System for Canadian River-class Destroyers
06/02/2025 | Rolls-RoyceRolls-Royce has reached agreement on a significant scope of work to support Batch One of the River-class destroyer (RCD) program for the Royal Canadian Navy.
Bourns Introduces Line Filter Series with Ferrite Toroid Core that Delivers High Impedance Over a Broad Frequency Range
05/30/2025 | BournsBourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced a new filter series designed with a ferrite toroid core. Bourns specifically engineered its SRF1360 line filters to deliver high impedance over a broad frequency range.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.