Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System LS9300AD for Wafer Manufacturers
March 15, 2024 | ACN NewswireEstimated reading time: 1 minute

Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer surfaces for particles and defects. In addition to the conventional dark-field laser scattering detection of foreign material and defects, the LS9300AD is equipped with a new DIC (Differential Interference Contrast) inspection function that enables detection of irregular defects, even shallow, low aspect microscopic defects. LS9300AD has the wafer edge grip method and rotating stage currently used in conventional products to enabling front and backside wafer inspection.With the introduction of LS9300AD, Hitachi High-Tech enables reduced inspection costs and improved yield for semiconductor wafers and semiconductor device manufacturers by providing high-sensitivity and high-throughput detection of low-aspect microscopic defects.
Inspection of non-patterned semiconductor wafers' (before circuit pattern formation) surfaces and backside surfaces has been used in quality assurance during wafers shipment and acceptance, as well as for particles control in various semiconductor device manufacturing processes.Semiconductor wafers manufacturers, use it for quality control to inspect defects and particles that occur during the wafer manufacturing process. In recent years, semiconductor devices have become smaller and more complex, so the size of defects and foreign matter that affect yield in the semiconductor device manufacturing process has become smaller. Due to this, the need for managing all types of defects, including low-aspect microscopic defects on the surface and backside of wafers, is increasing. Responding to the changes in the social environment semiconductor production is expected to increase. To control inspection costs, high-sensitivity and high-throughput inspection equipment is required.
Suggested Items
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
04/29/2025 | Mike Konrad -- Column: The Knowledge BaseFrom detecting voids under BGAs to solder defects in high-reliability applications, X-ray inspection has become an indispensable tool in modern manufacturing. But how is the technology evolving? What challenges do experts face in deploying X-ray inspection effectively and what does the future hold for this critical quality assurance method?
The Future of Advanced Packaging Inspection Is X-ray
04/22/2025 | David Kruidhof and Kevin Jan, Comet YxlonDriven by smartphones, high-performance computers, and artificial intelligence, the global demand for high-end computing power is constantly rising. The industry is also facing demands for miniaturization, which creates the need for ever-smaller defect recognition. The semiconductor industry has been identifying and solving these challenges for decades using various optical inspection and SEM tools.
PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing
04/11/2025 | PRNewswirePCBAIR, a leading provider of PCB manufacturing and assembly services with fully automated production lines, announced that it is increasing funding for research and development to incorporate AI into its manufacturing processes, dramatically improving defect prediction accuracy and efficiency.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
Delvitech to Officially Present Hybrid AOI + SPI Horus System at IPC APEX EXPO 2025
02/06/2025 | DelvitechDelvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry's first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.