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SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
March 26, 2024 | SEMIEstimated reading time: 2 minutes
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems. Registration is open.
Themed Heterogeneous Systems for the Intelligently Connected Era, this year’s SEMI 3D & Systems Summit will feature a broader scope of topics including market trends, chiplet design, hybrid bonding, Co-Packaged Optics (CPO), high-bandwidth computing and environmental sustainability.
“We look forward to hosting the most prominent names in 3D integration microelectronics manufacturing to showcase their latest products and technologies at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “With advanced packaging innovations critical to enabling environmental sustainability while increasing chip performance, we look forward to hosting experts who will discuss the microelectronics industry’s work to explore more eco-friendly alternatives to conventional materials.”
3D Summit Sessions
Session 1: Semiconductor Market Trends and European Impact
Executive leaders will analyze the dynamic relationship between global semiconductor trends and the European landscape, highlighting the implications for Europe’s economic expansion and technological progress.
Session 2: Chiplet System Architectures – Design and Technologies
Industry experts will delve into dynamic chiplet design, emphasizing innovative approaches, emerging trends, optimization strategies, and packaging solutions that drive chiplet innovations.
Session 3: Hybrid Bonding Technologies for Advanced 3D Integration
Specialists will spotlight the latest advancements in hybrid bonding technologies, focusing on recent developments, novel techniques, and emerging applications. Speakers will highlight hybrid bonding’s transformative potential for enhancing semiconductor performance and overall functionality.
Session 4: Manufacturing Innovation for 3D Integration
Visionaries will showcase the newest hybrid bonding advancements, emphasizing their potential to enhance chip performance, efficiency, and functionality through recent innovations and emerging applications.
Session 5: Co-Packaged Optics (CPO) – Innovations for High Bandwidth Computing
Leaders will explore CPO as an advancement in integrated photonics, highlighting its cost-effectiveness, enhanced integration, and potential to improve performance in data transmission and processing systems.
Session 6: Materials and Processes Supporting Environmental Sustainability
Experts will spotlight semiconductor industry efforts to prioritize environmental sustainability through collaboration, innovation, and a continued commitment to exploring eco-friendly alternatives and reducing the industry’s environmental footprint.
Global Leaders to Present
3D & Systems Summit presenters include experts from these global leaders:
- CARIAD
- CEA-Leti
- EPIC
- EV Group
- Fraunhofer IIS-EAS
- Fraunhofer IZM-ASSID
- imec
- KLA Corporation
- MKS-Atotech
- NVIDIA
- Silicon Saxony
- SPTS Technologies Ltd., a KLA company
- STMicroelectronics
- TechSearch International, Inc.
- Exhibition and Business Networking
The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.
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