Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

NVIDIA, MediaTek Deepen AI Edge-to-Cloud Partnership

09/01/2026 | NVIDIA
NVIDIA and MediaTek announced a deepening of their longstanding collaboration to build the next generations of AI computing platforms — spanning AI infrastructure, local AI computing and automotive.

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

Viasat Selects Rocket Lab to Build GEO Satellite for U.S. Space Force Program

08/17/2026 | Globe Newswire
Viasat Inc., a global leader in satellite communications, today announced it selected Rocket Lab Corporation, a leading launch and space systems company, to build a satellite bus for the U.S. Space Force’s (USSF) Space Systems Command (SSC) under the Protected Tactical SATCOM-Global (PTS-G) program.

NVIDIA Partners With Major Firms to Mobilize $500B for AI Infrastructure

08/13/2026 | NVIDIA
NVIDIA announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time.

Teledyne Marine Advances Allied Undersea Capabilities During AUKUS Exercise Lanternfish

08/13/2026 | BUSINESS WIRE
Teledyne Marine, representing a group of subsea technology providers within Teledyne Technologies Incorporated, participated in Exercise Lanternfish 2026, a multinational AUKUS Pillar 2 exercise focused on advancing seabed warfare capabilities and protecting critical undersea infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in