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UHDI Fundamentals: UHDI Technology and Industry 4.0

09/03/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

Nolan’s Notes: Everyone Has Their Eye on India

09/03/2025 | Nolan Johnson -- Column: Nolan's Notes
In this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping Indian EMS companies with standards and certifications that would give EMS companies a footing to enter a global EMS market.

MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider

08/28/2025 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.

Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs

08/27/2025 | Michael Carano -- Column: Trouble in Your Tank
To quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons. 

Liquid Cooling to Scale in AI Data Centers, Penetration to Surpass 30% in 2025

08/21/2025 | TrendForce
TrendForce’s latest research on the liquid cooling industry reveals that the rollout of NVIDIA’s GB200 NVL72 rack servers in 2025 will accelerate AI data center upgrades, driving liquid cooling adoption from early pilot projects to large-scale deployment.
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