-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
HCLTech Launches EDA Solution Powered by NetApp to Accelerate EDA Workloads in the Cloud
April 11, 2024 | HCLTechEstimated reading time: 1 minute
HCLTech, a leading global technology company, announced the launch of an Electronic Design Automation (EDA) solution in partnership with NetApp, to enable enterprises in the semiconductor industry to accelerate large EDA implementations in the hybrid cloud to significantly reduce their time-to-market, enhance the overall quality and improve the reliability of their products.
With HCLTech’s new joint offering, clients can leverage NetApp’s Design Anywhere solution to streamline the entire semiconductor design process, from concept to manufacturing, with improved scalability and flexibility. Enterprises can harness the power of hybrid cloud to efficiently manage growing data volume and workflow complexities.
HCLTech will support clients running large EDA projects by optimizing their IT environments, managing infrastructure orchestration and scheduling for EDA workloads along with associated services. HCLTech will also deliver the EDA solution in various consumption models as per client requirements in partnership with NetApp.
“We are thrilled to collaborate with NetApp to unlock the power of hybrid and multi-cloud to help enterprises transform operations and build resilience across their digital businesses. Our new joint solution will enable our clients make the most of their high-performance compute workloads across a wide range of private or public clouds,” said Rampal Singh, Head Hybrid Cloud Services, HCLTech.
“The power and availability delivered in the cloud creates new opportunities for our customers to run EDA workloads without the risks of overprovisioning or capacity shortfalls. NetApp’s expertise in unifying data helps HCLTech clients unlock the potential of their hybrid cloud investments to make their product development process more flexible and efficient,” said Cesar Cernuda, President, NetApp.
Suggested Items
Kitron Secures Contract for Components Supporting Unmanned Aerial Systems
07/04/2025 | KitronKitron has received a contract with an estimated value between EUR 4 and 8 million for the production and supply of advanced electronic components used in unmanned aerial systems (UAS).
Synopsys, Ansys Provide Update Regarding Expected Timing of Acquisition Close
07/03/2025 | ANSYSSynopsys, Inc. and Ansys released the following statement related to the status of the regulatory approvals for Synopsys’ proposed acquisition of Ansys.
Wayve Expands Engineering Leadership to Power Next-Gen Autonomous Driving Technology
06/27/2025 | BUSINESS WIREWayve, a pioneer in Embodied AI for automotive, announces the appointments of Rob Flenniken, Uri Wolfovitz, and Dennis Jackson, strengthening its engineering leadership.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
Siemens Turbocharges Semiconductor and PCB Design Portfolio with Generative and Agentic AI
06/24/2025 | SiemensAt the 2025 Design Automation Conference, Siemens Digital Industries Software today unveiled its AI-enhanced toolset for the EDA design flow.