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IFTEC’s Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024
April 11, 2024 | IPCEstimated reading time: 1 minute
In recognition of his extraordinary contributions to IPC and the electronics manufacturing industry, Pierre-Jean Albrieux, president of IFTEC-France, was inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Albrieux was honored for his enthusiastic support for IPC’s mission to serve the electronics industry as an advocate for IPC training and certification. Under Albrieux’s leadership, IFTEC has translated multiple IPC standards, training programs for IPC certifications, and Certified IPC Designer and Certified IPC Designer+ study guides into French. IFTEC has been involved in IPC hand soldering competitions in France since 2016, with staff serving as judges at competitions and championships throughout Europe. IFTEC staff members also participate in approximately 30 standards development and training committees.
A winner of the IPC President’s Award in 2016, Albrieux was recognized for shaping IFTEC into a leading and model IPC Training and Certification Center and Distributor in Western Europe, growing IPC membership in France and promoting IPC services to industry and for overseeing the creation of the IPC Design Council Chapter in France.
Albrieux is deeply involved in the industry in France, especially with SNESE, (National Association of French Electronic Subcontracting Firms, the representative body of electronic subcontracting trade in France since 1983.
IPC President and CEO John Mitchell notes Albrieux’s accomplishments, “Those who work closely with Pierre-Jean immediately recognize his expertise, strong leadership skills and the knowledge and experience he possesses to accomplish as much as he has. He is respected as a subject matter expert, always ready to move the industry forward as a strong advocate for the development and use of IPC standards in France and beyond.”
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Julia McCaffrey - NCAB GroupSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.