Dan’s Biz Bookshelf: ‘In Defense of a Liberal Education’
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
It’s Only Common Sense: How to Win Back Lost Customers
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
April 26, 2024 | iNEMIEstimated reading time: 1 minute
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit. With a unified platform, chip designers creating hyperscale computing, consumer, 5G communications, mobile and automotive applications can achieve greater productivity versus a disjointed die-by-die implementation approach.
Cadence is one of the first to provide EDA solutions for advanced packaging and heterogeneous integration and is leading the industry in delivering them to market for better design with greater efficiency. This presentation will review advanced packaging technology trends and provide an overview of Cadence’s EDA platforms that enable seamless design from front-end to back-end for the new era of advanced semiconductor packaging.
About Sang-Hyun Lee, Ph.D.
Sr. Principal Product Engineer
Custom IC, Packaging and PCB Development Group
Cadence Design Systems / Seoul, Korea
Sang-Hyun Lee joined Cadence in 2023 and is working in development of Cadence EDA tools for advanced semiconductor packages. Prior to joining Cadence, he worked at Amkor Technology and Samsung Electronics in semiconductor package development. He had led multiple projects developing advanced packages such as 2.5D packages, wafer-level fan-out packages, MCM FCBGAs, CPO (Co-Packaged Optics) and SiPs.
Dr. Lee received his Ph.D. in Electrical Engineering from the University of Michigan (Ann Arbor, Michigan, USA). He has a master’s degree in material science from Korea Advanced Institute of Science and Technology (KAIST) (Daejon, Korea) and a bachelor’s degree in metallurgical engineering from Korea University (Seoul, Korea).
Registration
This webinar is open to industry; advance registration is required (see link below). If you have any questions or need additional information, please contact Masahiro Tsuriya.
Tuesday, May 21, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT on Monday May 20 (US)
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswireIn 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.
Benchmark Strengthens Presence in Jalisco with Grand Opening of Advanced Manufacturing Facility in Guadalajara
06/21/2025 | BUSINESS WIREBenchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, celebrated the grand opening of its brand-new manufacturing facility in Guadalajara, Mexico.
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
06/18/2025 | NHanced SemiconductorsAt the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies.
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements
06/12/2025 | SEMIThe MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.