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TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego

01/09/2025 | TopLine
TopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.

EpoxySet to Exhibit at MD&M West

12/05/2024 | epoxySet
EpoxySet Inc. will be exhibiting at MD&M West on February 4-6, 2025 in the Anaheim Convention Center, booth 617.

ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

12/02/2024 | ZESTRON
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield” 

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.

Tresky's Laser- and Photodiodes DIE Bonding in Optoelectronics

11/05/2024 | Tresky GmbH
In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role for the performance and lifespan of laser diodes (LD) and photodiodes (PD).
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