It’s Only Common Sense: Customer Service Is Sales in Disguise
Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
May 1, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Share on:
Suggested Items
ASMPT Introduces AERO PRO High-Performance Wire Bonder
07/09/2025 | ASMPTASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Mycronic’s Global Technologies Acquires Surfx in the US
06/03/2025 | MycronicMycronic’s Global Technologies division has acquired Surfx Technologies, a company headquartered in the US, providing atmospheric plasma solutions for surface treatment, including cleaning and active oxide removal.
DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot
06/03/2025 | TrendForceTrendForce’s latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in