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AIM Solder Acquires the Assets of Canfield Technologies

02/07/2025 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the acquisition of the assets of Canfield Technologies, a renowned producer of high-quality solders and fluxes since 1844.

UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2

02/06/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.

Technica USA Expands Partnership with ASMPT to Southern California and Southern Nevada

02/05/2025 | Technica USA
Technica USA is pleased to announce the expansion of its long-standing partnership with ASMPT, a global leader in hardware and software solutions for the electronics manufacturing and semiconductor industries. This expansion extends Technica USA’s representation of ASMPT into Southern California and Southern Nevada.

Global Sourcing Spotlight: Seven Key Challenges in Offshore Manufacturing

02/05/2025 | Bob Duke -- Column: Global Sourcing Spotlight
Offshore manufacturing has long been a strategy for companies seeking cost savings and access to specialized resources. However, it comes with a unique set of challenges that can complicate operations if not managed proactively. This month, we will examine the main difficulties of offshore manufacturing and offer advice on overcoming them for global success.

Koh Young Highlights Inspection Solutions at IPC APEX EXPO 2025

02/04/2025 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for live demonstrations of its award-winning inspection technologies.
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