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Cadence Tensilica HiFi 5 DSPs Used in NXP’s Next-Gen Audio DSP Family

09/19/2024 | Cadence Design Systems
In a significant achievement for the automotive industry, Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors' latest automotive audio DSP family, enabling advanced audio capabilities for next-generation software-defined vehicles.

DuPont Showcases Silver Nanowire Technologies at SID Vehicle Displays and Interfaces 2024

09/13/2024 | DuPont
DuPont showcased its unique and advanced silver nanowire technologies at the SID Vehicle Displays and Interfaces 2024. Leveraging its recently acquired assets from C3 Nano, Inc.

indie Semiconductor Unveils Advanced Qi2 Wireless Charging SoC for Automotive Applications

08/26/2024 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, has announced iND87204, its next-generation, highly-integrated automotive wireless charging system-on-chip (SoC).

Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing

08/23/2024 | PRNewswire
NEPCON ASIA 2024, one of the most influential events in electronics manufacturing, organized by RX Shenzhen, will take place from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an).

AI-Driven Evolution: ASMPT to Showcase Transformative Solutions at SEMICON Taiwan 2024

08/20/2024 | ASMPT
ASMPT Limited, the world's leading provider of hardware and software solutions for the semiconductor and electronics industries, will be exhibiting at SEMICON Taiwan 2024, Asia's leading electronics manufacturing event, from 4-6 September.
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