Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Bourns Introduces Line Filter Series with Ferrite Toroid Core that Delivers High Impedance Over a Broad Frequency Range

05/30/2025 | Bourns
Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced a new filter series designed with a ferrite toroid core. Bourns specifically engineered its SRF1360 line filters to deliver high impedance over a broad frequency range.

Neways Electronics Celebrates Grand Opening of New Manufacturing Facility in Malaysia

05/22/2025 | Neways Electronics International N.V.
Neways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, is proud to announce the grand-opening of a new state-of-the-art manufacturing facility in Selangor, Malaysia.

Mycronic High Flex Changes Division Name to PCB Assembly Solutions

05/20/2025 | Mycronic
Mycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.

ASMPT Presents Die Bonder with Intelligent Features

05/14/2025 | ASMPT
ASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.

Infineon’s Revenue Growth in Q2 Confirms Expected Economic Recovery

05/13/2025 | Infineon
Infineon Technologies AG is reporting results for the second quarter of the 2025 fiscal year (period ended 31 March 2025).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in