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Looking Into Space: EIPC Summer Conference, Part Two

06/17/2024 | Pete Starkey, I-Connect007
“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.

Material Matters: PCB007 Magazine June 2024 Issue

06/17/2024 | I-Connect007 Editorial Team
How a company manages its inventory has a tremendous effect on its financials. This is also true for PCB manufacturing. But, as with most things regarding printed circuit board manufacturing, nothing is as simple as in other business segments. Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. It is no surprise that the PCB industry is abuzz with energy around material matters.

Off Like a Rocket: A Review of the EIPC Summer Conference, Part 1

06/14/2024 | Pete Starkey, I-Connect007
Motorway traffic jams, airport car parking, walking for miles, queuing for security, delayed flights—oh, the joys of travelling. I was quickly reminded of my status as a foreigner while waiting patiently in line for a half-hour at passport control to enter the European Union at Amsterdam Schiphol, having flown all the way from London Luton in the United Kingdom, that great distance of 200 miles. 

Revolutionizing PCB Prototyping With ML and AM

06/14/2024 | Nick Geddes, Nano Dimension
Historically, PCB prototyping has been a meticulous and time-consuming process, often laden with complexities and high costs. Traditional methods have typically involved intricate design iterations, extensive manual labor, and significant material waste. However, the advent of AM has revolutionized this landscape, offering a rapid, cost-effective alternative that significantly accelerates the development cycle.

Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
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