Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Best Student Poster: Drop Shock Reliability
May 29, 2024 | Michelle Te, I-Connect007Estimated reading time: 1 minute
Two Auburn University doctoral candidates authored a poster on drop shock performance of solder alloys in BGA assemblies that won Best Student Poster at IPC APEX EXPO 2024. They received a $750 cash prize and a $2,000 scholarship.
Palash Vyas is a Ph.D. candidate in the Department of Industrial Engineering with more than three years of research experience in reliability testing of PCBs. His paper was co-authored by Soroosh Alavi, who has bachelor’s and master’s of science degrees in industrial engineering and is now in his third year as a doctoral student in industrial and systems engineering, while also working on a master’s degree in data science.
Both students are well-known to the IPC Education Foundation. Palash is a former president of the IPC Student Chapter at Auburn University. He also won Best Student Paper in 2022 for solder joint reliability during thermal cycling. Soroosh joined his IPC Student Chapter at Auburn in 2022. Both have won member and leadership scholarships over the past four years.
Of their 2024 poster, the judges noted that “the research is very novel” and “there is not a lot of research in this area of drop shock test of PCBs at elevated temperatures.” The judges said Palash and Soroosh have a good understanding of the subject matter.
Julia Flynn, IPC professional development coordinator, said the Technical Program Committee members who reviewed their poster “were impressed,” and gave them high scores all around for the technical content.
“I am deeply honored to have received the Best Poster Award,” Palash said. “Apart from alleviating the financial burden of tuition, the award will help strengthen my belief in my potential to make a difference in the electronics industry. It will greatly boost my motivation as a researcher.”
“The award is deeply meaningful to me,” Soroosh said. “It validates the hard work and dedication I’ve invested in my research and reassures me that my contributions are valuable to the field. This recognition not only motivates me to continue pushing the boundaries of what I can achieve but also reinforces my commitment to making impactful advancements in the industry.”
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.