Cambridge GaN Devices Signs MoU with ITRI Covering GaN-based Power Supply Development
May 30, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company, dedicating to develop energy-efficient GaN-based power devices that make greener electronics possible, has signed a Memorandum of Understanding with Industrial Technology Research Institute (ITRI) of Taiwan to solidify a partnership in developing high performance GaN solutions for USB-PD adaptors. The MoU also covers the sharing of domestic and international market information, joint visits to potential customers and promotion.
“We are excited to partner with ITRI, an organization with a power solution research team that is very experienced in developing power solutions and holds many patents. We will be demonstrating some of their board designs at our booth at the upcoming PCIM show in Nuremberg in June. These products utilize CGD's unique IC chip architecture and ITRI's patented designs to achieve product size reduction, high efficiency and power density, and cost competitiveness,” said Andrea Bricconi, Chief Commercial Officer, Cgd.
“CGD’s IC-enhanced GaN – ICeGaN – is a novel platform that improves ease-of-use, facilitates smart temperature control and enhances gate reliability. We are excited to include these benefits in our new power designs,” said Wen-Tien Tsai, Leader of Commercial Power Design Team, GEL/ITRI.
According to leading WBG analysts, Yole Group, the GaN market is expected to exceed $1B, with key growth in the applications of comms power supplies, and automotive DC/DC converters and on-board chargers. However, the first commercialized product in the market to adopt GaN devices has been USB-PD adaptors, and it is this market that the first designs from the partnership will address. Specifically, the agreement covers the development of power solutions in the 140-240 W range with power densities exceeding 30 W/in3 for e-mobility, power tools, notebook and cell phone applications.
Suggested Items
Microsoft’s Brad Smith Urges U.S. Leadership in Quantum Technology
04/29/2025 | I-Connect007 Editorial TeamIn a blog post published on April 28, 2025, Brad Smith, Vice Chair and President of Microsoft, underscores the critical need for the United States to accelerate investment in quantum technology. While public focus remains fixed on artificial intelligence, Smith argues that quantum computing is an equally vital frontier with the power to revolutionize industries and solve complex global challenges across science, medicine, energy, and agriculture.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.
PTCRB Certification Adds New IoT Chipset Certification Category, Certifies Sony's Altair ALT1350 CTIA Certification
04/23/2025 | PRNewswireCTIA Certification announced the first PTCRB certified IoT chipset, Sony's Altair ALT1350.
Flex Wins Two 2025 PACE Awards for Innovation in Automotive Compute and Power Electronics
04/22/2025 | PRNewswireFlex was named a two-time 2025 Automotive News PACE Award winner at the awards ceremony on April 15, recognized for its industry-leading Jupiter Compute Platform and Backup DC/DC Converter design platforms.