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Electronics Industry Sentiment Dips in December

01/03/2025 | IPC
The electronics industry faced a dip in sentiment this December, as the Demand Index declined 1.8 percent according to IPC’s December Sentiment of the Global Electronics Manufacturing Supply Chain Report. It remained below 100 for the fourth consecutive month, signaling continued contraction.

BOOK EXCERPT: The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, Chapter 4

12/31/2024 | I-Connect007
Bio-based encapsulation resins have the potential to contribute to sustainability targets by extending product lifetime and improving performance. The author explores the use of recycled materials such as biogenic waste and lightweight expandable polymers to create more efficient and environmentally friendly encapsulation resins.

AGC Multi Material to Showcase Substrate Materials at DesignCon 2025

12/31/2024 | AGC Multi Material America
AGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.

Rogers Announces Addition of Woon Keat Moh to Board of Directors

12/23/2024 | Rogers Corporation
Rogers Corporation announced that Woon Keat Moh ("Moh") has been appointed as an independent member of the Company’s Board of Directors, effective January 1, 2025. Following this change, the Board will be composed of nine members, eight of whom are independent.

Effects of Advanced Packaging and Stackup Design

12/26/2024 | I-Connect007 Editorial Team
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
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