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Advanced Electronics Packaging Digest

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Suggested Items

Teradyne Launches Advanced UltraFLEXplus Instruments Engineered for AI and Data Center Computing Devices

09/03/2026 | Teradyne
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing.

Brewer Science Acquires Heraeus Epurio Semiconductor Chemicals Business

08/05/2026 | PRNewswire
Brewer Science, Inc., a global leader in advanced materials and processes for the fabrication of cutting-edge microdevices, announced it has completed its acquisition of the semiconductor chemicals business line of Heraeus Epurio, a recognized technology leader in ultrapure electronic chemicals for the semiconductor industry.

Lockheed Martin to Acquire Ultra Maritime Solutions

07/06/2026 | PRNewswire
Lockheed Martin announced the signing of a definitive agreement to acquire Ultra Maritime, a global defense company specializing in advanced undersea warfare and anti-submarine warfare (ASW) capabilities for allied naval forces for $3.45 billion.

NVIDIA's 800V Power Rack Debuts with Vera Rubin

06/25/2026 | TrendForce
TrendForce's latest research on power architectures for AI servers highlights that NVIDIA has been developing its proprietary 800V HVDC Power Rack.

TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

06/23/2026 | TTM Technologies
TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.
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