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Spirit Electronics Adds Zero-Error Systems to Provide Ultra-High Reliability Protection from Radiation in Space Applications

10/25/2024 | Spirit Electronics
Spirit Electronics announces franchised distribution for Zero-Error Systems (ZES) to support ultra-high reliability semiconductors and ICs operating in challenging radiation environments. 

UHDI Fundamentals: ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1

10/10/2024 | Anaya Vardya, American Standard Circuits
As soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.

Introducing the Ultra HDI Learning Pavilion at SMTA International 2024

10/07/2024 | SMTA
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.

HCLTech Announces AI-based Solutions Powered by Intel Core Ultra Processors

10/04/2024 | HCLTech
HCLTech, a leading global technology company, will provide advanced AI-driven digital workplace solutions utilizing Intel Core Ultra processors.

AIM to Present on Ultra-Miniature Component Assembly at SMT-Info

10/02/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.
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