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Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing

12/05/2024 | Real Time with... electronica
Michael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.

SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

11/26/2024 | SMTA
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.

Spirit Electronics Adds Zero-Error Systems to Provide Ultra-High Reliability Protection from Radiation in Space Applications

10/25/2024 | Spirit Electronics
Spirit Electronics announces franchised distribution for Zero-Error Systems (ZES) to support ultra-high reliability semiconductors and ICs operating in challenging radiation environments. 

UHDI Fundamentals: ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1

10/10/2024 | Anaya Vardya, American Standard Circuits
As soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.

Introducing the Ultra HDI Learning Pavilion at SMTA International 2024

10/07/2024 | SMTA
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.
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