Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Aismalibar to Attend PCIM 2024
June 5, 2024 | AismalibarEstimated reading time: 1 minute
Aismalibar will be attending PCIM 2024 in Nuremberg, Germany from June 11th to 13th, presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS). PCIM is the leading international exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. The exhibition and conference are the international meeting point for the industry. Aismalibar will exhibit in booth 449 Hall 9 of the Nuremberg Exhibition Grounds.
Aismalibar Thermal Interface Materials have been designed to improve dielectric isolation and fast thermal transmission in power electronics and battery packs among others, taking into consideration cost reduction, lifetime performance, safety, and reliability.
Thermal Interface Materials are divided into two main areas, differentiated based on whether they need dielectric capacity. The dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation. Additionally, Aismalibar has developed a series of applicable surfaces on the TIMs, differentiated by whether they need to be self-adhesive. Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.
Aismalibar has a wide range of thermal management solutions, but this year it will focus on presenting the following new products:
- The BOND SHEET CURED GLASS FREE is used for Thermal Interface material in power electronics and battery isolation with 3,2w/mK and 4 to 6Kv dielectric strength.
- Thermal FR4 used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of the Aismalibar thermal FR4 can reduce a 15% d the operating temperature of power components by improving the output or extending the life of the component.
- Insulated Metal Substrate COBRITHERM ULTRATHIN 5W and 8W used in high-end power AC/DC converters and high-power LED industry.
- And COBRITHERM ALP, made from an Aluminium base coated with a 100-micron dielectric ceramic layer with extra low thermal resistance and high dielectric strength up to 6KV. It is ideal for building battery housing, covers, partitions or radiators, power electronics and comfortable heat sinks, among other solutions. It is completely insulated and guarantees excellent contact between the battery and dissipation elements.
Share on:
Suggested Items
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Teledyne FLIR, VSI Labs Testing Shows How Thermal Imaging Helps Vehicle Makers Meet Nighttime AEB Federal Safety Standards
12/12/2024 | BUSINESS WIRETeledyne FLIR OEM, part of Teledyne Technologies Incorporated, in collaboration with VSI Labs today issued test results utilizing the new Federal Motor Vehicle Safety Standard (FMVSS) No. 127 pedestrian automatic emergency braking (PAEB) testing scenarios.