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Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3

06/25/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Tin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.

Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25

06/22/2025 | Insulectro
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA. 

MVTec, Siemens Expand Technological Cooperation

06/12/2025 | MVTec
MVTec Software GmbH and Siemens are expanding their technological cooperation in the field of industrial automation. To reinforce their increasingly close collaboration, Siemens joined the MVTec Technology Partner Program in May 2025.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd

ACCM Joins Polar’s Speedstack Material Partner Program

06/10/2025 | Polar Instruments
Advance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain. 
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