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Indium Wins EM Asia Innovation Award

05/01/2025 | Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.

Indium to Showcase Durafuse Solder Technology at NEPCON Japan

01/21/2025 | Indium Corporation
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show

10/01/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.

Indium to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications

04/09/2024 | Indium Corporation
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

Indium Expert to Present on Unique High-Reliability Alloy Technologies at IEMT

09/23/2022 | Indium Corporation
Indium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications, during two presentations at the International Electronics Manufacturing Technology (IEMT) conference, Oct. 19-21, Putrajaya, Malaysia.
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