Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Wolfspeed Signs Multiyear SiC Agreement for EVs

10/30/2026 | Wolfspeed
Wolfspeed, Inc., a global leader in silicon carbide technology, announced a multiyear supply agreement for Wolfspeed silicon carbide devices to support BorgWarner’s next-generation 800V silicon carbide-based inverter platform as strategic partner.

Wolfspeed Expands 200 mm Silicon Carbide Portfolio with New Premium Power Substrates

09/28/2026 | BUSINESS WIRE
Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the commercial availability of its new Premium 200 mm n-type silicon carbide substrate, expanding its 200 mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability.

Knocking Down the Bone Pile: Minimizing X-ray Dosage During PCB Inspection

09/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
The ability to non-destructively inspect PCB assemblies is extremely important for verifying product quality without compromising the assembly. X-ray inspection provides a non-destructive method for examining optically hidden features that cannot be evaluated using automated optical inspection (AOI) or microscopic inspection. This makes it particularly valuable for verifying solder joint interconnections beneath BGAs, chip-scale packages (CSPs), and other bottom-terminated components.

SEMI Joins ReSiLient Consortium to Strengthen Europe’s Silicon Supply Chain

09/17/2026 | SEMI
SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced it has joined the ReSiLient project consortium to help fortify Europe’s semiconductor ecosystem and advance global supply chain resilience.

IBIDEN Raises FY2026 Outlook on Strong AI Semiconductor Demand

08/05/2026 | IBIDEN
IBIDEN reported strong first-quarter fiscal 2026 performance, driven by robust demand for GPUs, high-end CPUs, and AI-related semiconductor package substrates.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in