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UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony

04/01/2025 | BUSINESS WIRE
United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony.

Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch

03/27/2025 | Jerome Larez -- Column: Global PCB Connections
As a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.

IPC’s Call to Action for the EU Competitiveness Compass

03/19/2025 | Nolan Johnson, I-Connect007
The European Union Competitiveness Compass is a strategic roadmap adopted by the European Commission to guide priorities for the next five years. In this interview, Alison James, IPC senior director of Europe government relations, explains how IPC has been proactive in aligning with the roadmap by conducting a study and organizing an electronics industry Call for Action that highlights the need to bolster Europe’s electronics manufacturing base and reduce regulatory and administrative burdens.

EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI Automated Production Wafer Bonding System

03/18/2025 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers.

UHDI Fundamentals: UHDI Advances Neurotechnology

03/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.
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