Pattern Plating: Latest Episode of On the Line With: Designing for Reality Now Available
July 1, 2024 | I-Connect007Estimated reading time: 1 minute
Don't miss the latest episode of "On the Line with…ASC Sunstone: Designing for Reality." We are three-quarters through the podcast series, where ASC Sunstone’s VP Matt Stevenson takes series host Nolan Johnson through the manufacturing process. This week’s topic is pattern plating, a crucial step in fabrication. Matt describes the process and the constraints in the chemistries that must be managed to meet the customer's manufacturing tolerances.
This series provides specific insights that can impact circuit board manufacturing, offering tips and tricks for optimizing design, fabrication, yields, and cost.
I-Connect007 is dedicated to providing digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of original content for the global electronics industry.
Visit our educational resource center to access more free content.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.